Silicon photonics workshop

Packaging and test challenges for industrialization of silicon photonics

23 May 2011, 13:30-18:00

Munich Trade Fair Center


Objectives

The global silicon photonics product market is expected to grow very fast in the next ten years. The manufacturing of silicon photonics components is moving towards cost-effective, high volume and high yield fabrication processes to meet the market requirements. This workshop aims to provide insight in the current status of the industrial development of this technology.

Companies and research centres will describe their vision of silicon photonics with a focus on the requirements and challenges for innovative test, packaging and device integration solutions.

This workshop is organized by the European Silicon Photonics Cluster

Agenda

TimeTopicSpeakers
13:30Registration and Coffee
14:00State of the art in silicon photonics and technology roadmapLaurent Fulbert, CEA-LETI
14:30Industrial requirements Bert Offrein, IBM
Didier Sauvage, 3S Photonics
Henri Porte, Photline
Mike Wale, Oclaro
Andreas Hakansson, DAS Photonics
16:00Coffee break & poster session
16:30ITRS packaging roadmapJürgen Wolf, Fraunhofer IZM
16:45State of the art and trends in silicon photonics packagingLars Zimmermann, TU Berlin
17:00Evolution of ePIXfab foundry servicePieter Dumon, imec
17:15Open discussion
18:00End of the workshop

Registration

The participation in the workshop is free but registration is mandatory.

=> Please register by filling the form here!

Further info

For any question, contact Tolga.Tekin(at)izm.fraunhofer.de, laurent.fulbert(at)cea.fr or pieter.dumon(at)imec.be